Turck’s new Interface Module Backplane (IMB) combines high I/O density with easy handling and rugged mounting technology
Turck is pleased to present the new Interface Module Backplane (IMB) that combines installation space for up to 32 I/O channels with standardized system connections and a redundant power supply (24 VDC). The new point-to-point solution can be equipped with digital I/O modules and Hart- and DTM-configurable analog interfaces, which allow users to embed the rugged device into a consistent asset management. Thanks to lesser costs per channel, the IMB is equally suitable for highly upgraded control cabinets with several hundred I/O connections and simple applications with only a few I/O connections.
On a very compact footprint of only 175 x 210 mm, the backplane provides installation space for up to eight interface modules that can carry a maximum of 32 digital or 16 analog I/O connections. Turck’s highly available standard cables for the analog/digital system connections, provide a new degree of installation comfort for the interface layer. Maintenance and potential upgrades can easily be carried out, because the maintenance personnel can conveniently plug in the new interfaces.
The new IMBs follow the trend towards consistent asset management strategies: The two-channel analog I/O modules allow Hart-communication and enable users to establish a digital fieldbus system using the existing 4…20mA connections. In this way, users can parameterize their analog devices with a single non-proprietary engineering tool, like the license-free PACTware software.